About this item

• LGA1851 AND LGA1700 CONTACT FRAME: Improved contact pressure distribution through Intel mounting frame for efficient heat transfer. thanks to even CPU contact surface
• NATIVE AMD OFFSET MOUNTING: Optimized for the multi-die chiplet design of Ryzen processors – 5mm offset for optimal coverage of the CPU hotspot. resulting in more efficient heat transfer
• ACTIVE COOLING OF THE VOLTAGE CONVERTERS: PWM-controlled VRM fan that additionally cools components in the base area. such as voltage converters
• INTEGRATED CABLE MANAGEMENT: The PWM cables of the radiator fans are integrated into the jacket of the hoses. which means that only one visible cable is connected to the motherboard
• LIMITED COMPATIBILITY WITH A FEW MOTHERBOARDS: Oversized coolers on the M.2_1 slot can lead to compatibility problems. An overview and solution is available in the technical data. in the manual and on the manufacturer’s website. Please use the compatibility check